Henkel introduces liquid gap filler for automotive and power conversion electronics

Henkel has announced the debut of its latest thermal interface material (TIM), Bergquist Gap Filler TGF 7000. The liquid TIM combines high thermal conductivity of 7.0 W/mK with a dispensing speed of 18 grams per second. The material is designed for applications such as advanced driver-assistance systems (ADAS), power conversion systems, electric pumps and electronic control units.

“From a chemistry perspective, engineering a liquid TIM with substantive filler content that also allows fast dispensing is an exceptionally difficult balance to achieve,” explains Holger Schuh, Henkel Global Technology Expert. “One might expect a liquid material with high thermal conductivity to experience separation, settling, caking and clogging of the dispensing equipment, but Bergquist Gap Filler TGF 7000 exhibits none of these issues.”

A silicone-based, two-part liquid gap-filling TIM, Bergquist Gap Filler TGF 7000 cures in place at room temperature. The material is soft upon curing to minimize stress, and has controlled volatility with siloxane content below 300 parts per million (ppm) to provide compatibility with various bonding surfaces and optical components. 

“For next-generation automotive designs where form and function are inherently linked, smaller, high-power components are enabling lighter, sleeker and more sophisticated vehicles,” says Schuh. “Without effective thermal control solutions like our new Gap Filler, these advances would not be possible.”

Source: Henkel