Alpitronic’s HYC50 charger to use Infineon’s EasyPACK modules and driver IC

Italian charger designer and manufacturer Alpitronic has chosen the EasyPACK 1B and 2B modules and EiceDRIVER X3 driver IC from German semiconductor manufacturer Infineon for Alpitronic’s HYC50 charger, which will be launched in the second quarter of 2022.

The HYC50 is a wall-mounted 50 kW DC fast charger with two charging ports. The EasyPACK 1B and 2B modules are composed of CoolSiC Metal Oxide Semiconductor Field Effect Transistors (MOSFETs), and feature an NTC temperature sensor and PressFIT contact pins. Infineon says its modules increase power density by about 50 percent, and its CoolSiC MOSFETs decrease the noise level from 65 dB to less than 50 dB.

According to Infineon, its EiceDRIVER X3 driver IC can be set up with additional sensor points for monitoring temperature and gate voltage, the temperature and voltage can be adjusted to reduce static conduction losses and prevent overloads, and OTA updates can align the X3 driver IC with local environmental conditions.

Source: Infineon

Comment
Create Account. Already Registered? Log In

Virtual Conference on EV Infrastructure: Free to Attend

Don't miss our next Virtual Conference on June 10-12, 2024. Register for the free webinar sessions below and reserve your spot to watch them live or on-demand.

LOAD MORE SESSIONS

Webinars & Whitepapers

EV Tech Explained