Italian charger designer and manufacturer Alpitronic has chosen the EasyPACK 1B and 2B modules and EiceDRIVER X3 driver IC from German semiconductor manufacturer Infineon for Alpitronic’s HYC50 charger, which will be launched in the second quarter of 2022. The HYC50 is a wall-mounted 50 kW DC fast charger with two charging ports. The EasyPACK 1B… Read more »
Infineon has released the EasyPACK 2B EDT2, a flexible and scalable half-bridge power module. The 750 V device can reach a maximum power of up to 50 kW and current of 230 A rms. The module is optimized for inverter applications in hybrid and electric vehicles. The main feature of the EDT2 technology is higher… Read more »
Pre-Switch is pioneering AI to control power transistors in order to increase inverter switching speeds to new highs. This will reduce motor losses enabling greater EV range. So far, the company has demonstrated an Inverter efficiency of over 99.3% peak efficiency at 100kHz using low only 3 cost SiC 35mΩ MOSFETs. Join this session at… Read more »
Infineon Technologies has introduced a new automotive power module with CoolSiC MOSFET technology. At this year’s virtual PCIM trade show, Infineon will present the new HybridPACK Drive CoolSiC, a full-bridge module with a 1,200-volt blocking voltage optimized for EV traction inverters. The power module is based on the automotive CoolSiC trench MOSFET technology for high-power… Read more »
Infineon‘s new 650 V CoolSiC Hybrid Discrete for Automotive contains a 50 A TRENCHSTOP 5 fast-switching IGBT and a CoolSiC Schottky diode. The combination supports bidirectional charging, making it suitable for fast-switching automotive applications such as onboard chargers, power factor correction, and DC-DC or DC-AC converters. Infineon says the integrated fast-switching 50 A IGBT enables… Read more »
Infineon Technologies has introduced the HybridPACK DC6i, a new IGBT power module tailored to the needs of EV traction inverters in the 80 kW to 100 kW power class. It combines Infineon’s EDT2 IGBTs with package technologies for compactness, thermal management at reduced material cost and easy installation. Within Infineon’s portfolio, the HybridPACK DC6i is… Read more »
Danfoss and Infineon Technologies have signed a multi-year volume supply agreement. Infineon will supply chipsets of IGBTs and diodes to Danfoss Silicon Power, to be used in power modules for inverters that control EV motors. “The market for electromobility is picking up noticeably, and the supply industry is getting ready for this,” said Claus Petersen,… Read more »
At its virtual PCIM booth (July 1-3), Infineon Technologies will present the EasyPACK module with CoolSiC automotive MOSFET technology, a 1,200 V half-bridge module with an 8 mΩ/150 A current rating. With the introduction of the CoolSiC automotive MOSFET technology into the EasyPACK, Infineon is expanding the range of uses for the module family to… Read more »
German semiconductor manufacturer Infineon has introduced a new version of its IGBT7 chip in its TRENCHSTOP line that boasts 30% less static loss than previous models. The 1,200 V module provides a leading nominal current of 900 A. Infineon says this enables a 30% higher inverter output current from the same frame size compared with… Read more »
Semiconductor manufacturer Infineon Technologies has launched two new 1,200 V EasyPACK modules with SiC MOSFETs as part of its 1,200 V series. Infineon says the new product is designed to meet the growing demand for silicon carbide (SiC) solutions. Both the Easy 1B and Easy 2B integrate Infineon’s CoolSiC MOSFETs and are aimed at both… Read more »