TE Connectivity’s new EV solutions kits contain all of the company’s high-voltage terminals and connectors needed to create an assembly, now in a single package.
Kits are available for AMP+ HVA 280, AMP+ HVA 630, AMP+ HVP 800, AMP+ HVP 1100, and AMP+ IPT solutions designed for high-voltage EV applications.
“To make ordering and assembly easy, we are now offering these kits for high-voltage terminals and connectors,” said Product Manager Mike Brenner. “The hybrid and electric mobility solutions kits offer design engineers all of TE’s reliable parts needed for assembly in one package so they don’t have to worry about missing any parts or have to hassle with any order quantities.”
AMP+ HVA 280 finger-proof, touch-safe, two- or three-position low-medium current connectors and headers can be utilized with multi-core or individually shielded wire and include a discrete header design with a two-stage floating latch. The connector system also provides multiple latching options and an integrated internal HVIL.
AMP+ HVA 630 touch-safe two-, three-, four- and five-position low-medium current connectors and headers are designed to meet AK 4.3.3, LV215-1 specifications, and feature CPA (Connector Position Assurance). The AMP+ connectors and headers can carry up to 40 A at 140° C, and will accommodate 4-6 mm2 multicore wires. The shielded and sealed two-position connectors are designed for high-voltage onboard chargers. The five-position connectors allow three-phase charging currents up to 32 A for maximum charging capacity with a necessary mating force below 70 N. The package includes an integrated HVIL.
The touch-proof one-, two- or three-position high current connectors and headers found in the AMP+ HVP 800 kits are designed to meet AK 4.3.3, LV215-1 specifications. They can handle currents up to 200 A at 85° C, depending on wire cross-section. An integrated internal HVIL with multiple routing options is included, as well as a lever for low insertion force.
AMP+ HVP 1100 finger-proof, touch-safe, one-position high-current connectors and headers have a current-carrying capability up to 300 A at 85° C and 70 mm2. The system provides an integrated internal HVIL.
Finally, TE’s AMP+ IPT shielded ring tongue, available in one-, two- or three-pole housings, provides 360-degree EMC shielding and wire-to-device capabilities. The screwed ring tongue can be applied on different length cables, according to the needs of the customer.
Source: TE Connectivity
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