Infineon Technologies has joined forces with TDK to develop an integrated solution for inverters to be used in e-mobility powertrains. The idea is to enable developers to test and implement drive concepts quickly and easily.
To create an inverter that’s optimized for automotive applications, Infineon and TDK redeveloped the key components and matched them perfectly with each other, thus improving on Infineon’s existing HybridPACK. The new HybridPACK module uses the latest IGBT3 chip generation, with a dielectric strength of 705 V, and features six DC terminals instead of the previous two.
The current capability of the HybridPACK module has been enhanced, and the power capability of applications based on the current HybridPACK1 with two DC terminals can be expanded easily with the HybridPACK1-DC6 because the new module has nearly the same dimensions as its predecessor. This provides scalability for various EV applications.
TDK has also developed a space-saving EPCOS DC link capacitor and a series of twin-conductor high-voltage DC filters specially tailored to the demands of electric drives for vehicles.