Challenges And Solution For Pick And Place Automation Of Thermal Gap Filler Pads

Presented by:

  • Christian Miraglia, Applications Engineering Manager Fujipoly America-Customer Engineering Resource Center (CERC), Fujipoly America

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Apr 18, 2024, 12:30 pm EDT

Automation in electronics manufacturing is nothing new, but today many thermal gap filler pads are still placed by hand. With an increasing demand for automation the need to incorporate gap filler pad installation into automated processes is growing.

In this webinar we will discuss what makes gap filler pads a challenge for pick and place manufacturing processes and how to address the specific handling challenges of gap filler pads.

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