Semiconductor manufacturer Nexperia has launched a new AEC-Q101-qualified Repetitive Avalanche Application-Specific FET (ASFET) portfolio focused on powertrain applications. The company says the devices have been tested to 1 billion avalanche cycles, and can be used to control automotive inductive loads such as solenoids and actuators. In addition to providing a faster turn-off time (up to… Read more »
Microchip Technology is introducing its newly-qualified 700 V and 1,200 V SiC Schottky Barrier Diode (SBD) power devices, providing EV system designers with solutions that meet AEC-Q101 quality standards across a wide range of voltage, current and package options. Microchip says the SBD family’s avalanche performance allows designers to reduce the need for external protection… Read more »
Mersen has introduced a new capacitor and busbar sub-assembly, called Fischerlink 2.0. Traditionally, capacitors are connected to busbars by screw or solder connections, which may cause increased inductance in the sub-assembly. Mersen’s Fischerlink 2.0 uses laser welding to connect capacitor terminals to busbars, which the company says improves the overall performance of the assembly and… Read more »
For years, we’ve been hearing about an EV technology that promises to be a game-changers: Vehicle-to-Grid (V2G) bidirectional charging. My recent work with one V2G charger developer, Fermata Energy, has convinced me that V2G has found its proverbial killer app: load peak shaving for commercial/industrial energy customers. This article is going to concentrate on the… Read more »
BorgWarner has announced that it is building an Integrated Drive Module (iDM) for Ford’s new all-electric Mustang Mach-E SUV. The iDM comes complete with a BorgWarner thermal-management system and a gearbox integrated with a motor and power electronics from other suppliers. “Our knowledge of system integration, paired with our gearing proficiency, allows us to design… Read more »
Infineon Technologies has introduced the HybridPACK DC6i, a new IGBT power module tailored to the needs of EV traction inverters in the 80 kW to 100 kW power class. It combines Infineon’s EDT2 IGBTs with package technologies for compactness, thermal management at reduced material cost and easy installation. Within Infineon’s portfolio, the HybridPACK DC6i is… Read more »
Apollo Future Mobility Group (AFMG) has announced that its subsidiary, GLM, has successfully completed the first prototype of a SiC Dual Inverter 800 V system for the EV market. The inverter system was co-developed with semiconductor manufacturer ROHM. The new inverter is equipped with a solid-state battery (SSB) battery management system (BMS), two inverters and… Read more »
ON Semiconductor will supply Danfoss Silicon Power with high-power IGBTs and diodes for inverter traction modules in the EV market. “Chip independency is an important and fundamental element of the Danfoss go-to market strategy. By selecting IGBT chips from ON Semiconductor, we are accommodating the high growth expectations from our automotive customers,” said Claus A…. Read more »
Engineers at Freudenberg Sealing Technologies have developed an elastomer that merges relatively high heat capacity with electrically insulating properties by combining silicone rubber with special fillers. Electronic components can be mounted in a thermally conductive aluminum housing, which dissipates heat through cooling water or convection. Senior Application Manager Armin Striefler explains why Freudenberg decided to… Read more »
Power Integrations has announced the production release of the InnoSwitch3-AQ, an AEC-Q100-qualified flyback switcher with integrated 750 V MOSFET and secondary-side sensing. The newly qualified device family targets EV applications such as traction inverters, OBC (on-board chargers), EMS (energy management DC/DC bus converters) and BMS (battery management systems). The InnoSwitch3-AQ uses the company’s high-speed FluxLink… Read more »