Hoenle Adhesives (formerly Panacol) has launched Structalit 8205, a board-level underfill designed for flip chips, BGAs and CSP packages in automotive electronics, power electronics and high-performance computing applications.

Underfills mechanically reinforce solder joints by filling the gap beneath packaged components and redistributing thermal stress—critical in automotive applications where power electronics and ADAS control modules are subject to sustained vibration and temperature cycling. Structalit 8205 uses a filler-modified epoxy formulation to lower the coefficient of thermal expansion, reducing differential stress between the component and board during thermal swings.

Hoenle says that in durability testing, the material survived 1,000 thermal cycles between −40 °C and +100° C, with solder joints intact after multiple reflows. In more extreme testing—100-plus cycles between −65° C and +150° C—no cracking was observed.

The material flows via capillary action at 80–100° C, achieving void-free coverage beneath components and a keep-out zone controllable below 300 µm. It’s compatible with standard jetting equipment using flat nozzles, operating at 60–90° C for dispensing. Rapid thermal curing is supported to keep cycle times short.

Source: Hoenle Adhesives