EV Engineering News

Infineon and Schweizer collaborate on silicon carbide-based power chip embedding

Infineon Technologies and Schweizer Electronic are working to embed Infineon’s 1,200 V CoolSiC silicon carbide-based chips directly onto printed circuit boards (PCBs).

The two companies have embedded a 48 V MOSFET on the PCB, showing the potential of their new chip embedding approach. The performance increased by 35% and demonstrated power semiconductors can be incorporated onto PCBs using Schweizer’s p2 Pack technology. Chip embedding enables highly integrated and efficient inverters that reduce overall system costs, according to Infineon.

“Infineon’s 100% electrically tested standard cells (S-Cell) can achieve high overall yields in the p² Pack manufacturing process,” said Thomas Gottwald, VP of Technology at Schweizer Electronic. “The fast-switching characteristics of the CoolSiC chips are optimally supported by the low-inductance interconnection that can be achieved with the p² Pack. This leads to increased efficiency and improved reliability of power conversion units such as traction inverters, DC-DC converters, or on-board chargers.”

Source: Infineon Technologies

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