Aluminum and hybrid polymer electrolytic capacitors have become an important part of most high-efficient electrical designs for xEV DC-link applications. These capacitor solutions have high ripple current capability and compactness helping to optimize the mechanical options required to develop DC/DC converters with higher performance.

Join this session at the Charged Virtual Conference on EV Engineering this Fall, presented by TDK Electronics, where we will discuss aluminum electrolytic capacitor technology and various characteristics, capabilities and features including compactness and equivalent series resistance (ESR), thermal properties, voltage rating and operating lifespan. There will be an overview of high-current solutions and capacity density capacitors for inverters and on-board charging. The session will also discuss mounting concepts that provides process flexibility and optimized designs for heat sink applications that enhance demanding xEV applications. Attendees will better understand how to select capacitors for any xEV DC-link project.

Register here—it’s free!

Other sessions at our Fall Virtual Conference include:

Flow Factors: Liquid Cooling For EV Charging

Learn about all of the various factors that influence flow rates and subsequently, liquid cooling performance for fast and extreme-fast charging. Coolant selection, component size, quick disconnect style/configuration and environment can all affect flow.

Attend this session, presented by CPC, to learn about all of the flow factors and their impacts. Discover how flow network modeling works and why liquid cooling system interdependencies should not be ignored.

Register here—it’s free!

See the full sessions list for the Fall Virtual Conference on EV Engineering here.

Broadcast live October 18 – 21, 2021, the conference content will span the EV engineering supply chain and ecosystem including motor and power electronics design and manufacturing, cell development, battery systems, testing, powertrains, thermal management, circuit protection, wire and cable, EMI/EMC and more.