Japanese semiconductor supplier Renesas has introduced a new automotive-qualified Bluetooth chip that combines a radio transceiver, an Arm M0+ microcontroller, memory, peripherals and security features in a compact system-on-chip (SoC) design.

The DA14533, the first device in the company’s Bluetooth Low Energy SoC range qualified for automotive applications, includes advanced power management features to simplify system integration and reduce power consumption.

The SoC can operate in an extended temperature range from -40° C to 105° C, allowing developers to incorporate it into applications from tire pressure monitoring and keyless entry to wireless sensors and battery management systems. Qualified against Bluetooth Core 5.3 specifications, the device also contains security features to safeguard connected devices from various threats.

The DA14533 includes an integrated DC-DC buck converter, which accurately adjusts the output voltage according to system requirements, according to the company. Active system power consumption is lower than comparable devices in the market, requiring only 3.1 mA during transmission and 2.5 mA during reception. In hibernation mode, the current drops to 500 nA. This helps extend the operational life of small-capacity battery-powered systems and meets the stringent power requirements of tire pressure monitoring systems.

A single external crystal oscillator (XTAL) is used for active and sleep modes, eliminating the need for a separate oscillator for sleep mode. The SoC is available in a compact WFFCQFN 22-pin 3.5 x 3.5 mm package and offers a low engineering bill of materials, integrating into space-constrained systems, reducing overall system costs and accelerating time-to-market.

The DA14533 is now available along with a Bluetooth Low Energy SoC Development Kit Pro. The kit includes a motherboard, a daughterboard and cables to facilitate application software development. The daughterboard is also available by itself to simplify development.

“This new automotive-grade device will enable a new class of Bluetooth LE applications that demand high power efficiency, a small footprint and broader temperature tolerance for next-generation battery-powered automotive and industrial systems,” said Chandana Pairla, VP of Connectivity Solutions Division at Renesas.

Source: Renesas Electronics