Mitigating Stress In PCB Assemblies: Understanding Thermal Gap Filler Compression And PCB Deflection

Presented by:

  • Daniel Rosero, Applications Engineer, Fujipoly

Mar 10, 2025, 1:30 pm EDT

Thermal gap fillers are essential for managing heat in today's compact electronics, but they can also introduce unwanted stress and deflection in your PCB assemblies.

Join us for this insightful webinar, where we'll unravel the complexities of thermal gap filler implementation and PCB mechanics. We'll explore:

• Types of Gap Fillers - Discover the differences of dispensable, putty, and viscoelastic gap fillers, and learn which is best suited for your application.

• Compression Characteristics - Understand how factors like gap filler type, thickness, and compression rate impact the stress exerted on your PCB

• PCB Deflection - Learn how a PCB reacts under load and how the addition of a gap filler and support structure location influences deflection

• Stress Management Techniques - Gain practical strategies for minimizing stress, including gap filler selection, optimized PCB layout, and support implementation

You will leave this webinar empowered to make informed decisions about thermal gap filler selection and application, ensuring your PCB designs remain stress-free and reliable.






All Sessions: March 2025 Conference


March 10-13, 2025: Free to attend!

All live webcast sessions are free to attend and will be recorded and available to watch on-demand after the event. Register for a session below and reserve your spot to watch it live or on-demand.

The first session topics are out now and many more are coming soon.

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