In the rapidly evolving field of artificial intelligence (AI), optimizing system performance and reliability is crucial for meeting the demands of complex computational workloads. As AI applications grow in complexity, the thermal management of high-performance processors is becoming more challenging. In this application note, we explore the role thermal interface material (TIM) 1.5 plays in the performance and reliability of AI systems.

By effectively managing heat dissipation, TIM 1.5 ensures optimal operating temperature, reducing the risk of thermal-induced failure and extending system longevity. As an advanced materials supplier, Honeywell has met the application requirements of electronic device manufacturers for more than 50 years and continues to provide vital materials for thermal management across multiple industries.