Discover how to leverage artificial intelligence (AI) to inspect batteries with 3D X-ray microscopy (XRM) as well as 2D techniques like electron and light microscopy. Understand how deep-learning based algorithms can be integrated without the need for user expertise in AI technology, even for complex components that are difficult to analyze using traditional measurement methods.

Join this webinar, presented by Zeiss, to see how automation of data acquisition and data analysis can accelerate productivity and increase the accuracy of results for characterization tasks in quality and failure analysis environments.

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Other sessions at our Spring Virtual Conference include:

Battery Modeling With COMSOL Multiphysics

Designing high-performance, durable, and safe batteries requires a detailed understanding of battery technology and the underlying physical processes. Modeling and simulation software helps designers look inside the battery in a way that is not possible using experiments. Battery systems are studied by various stakeholders with distinct goals and purposes. Depending on the purpose, modeling and simulation projects can be executed with different scopes.

In this webinar, we will discuss battery modeling at three different design scales: the microscale, cell scale, and pack scale. Then, we will provide a quick overview of the COMSOL Multiphysics® software user interface and the general Model Builder workflow. Finally, in a live demonstration, we will show how battery designers can use the features available in the COMSOL® software to evaluate and optimize different thermal management strategies for battery packs.

Reserve your spot—it’s free!

See the full session list for the Spring Virtual Conference on EV Engineering here.

Broadcast live on April 15-18, 2024, the conference content will span the EV engineering supply chain and ecosystem, including motor and power electronics design and manufacturing, cell development, battery systems, testing, powertrains, thermal management, circuit protection, wire and cable, EMI/EMC and more.