EV Engineering News

TDK’s new embedded gate driver powers efficiency in EV thermal systems

Japanese manufacturer TDK Electronics has extended the power capability of its Micronas high-voltage microcontrollers (HVC) 5x embedded motor controller family with its new HVC 5481G for automotive applications.

The chips are designed for local interconnect network (LIN)-controlled automotive blowers, pumps and fans in thermal systems. They can also power smart brushless DC motor (BLDC) actuators in seats, doors, liftgates and charge-port doors.

The HVC 5481G is a programmable gate driver system-on-chip (SoC) for control of an external power bridge with 6 N-channel FETs to drive actuators, fans, and pumps. Samples of the HVC 5481G are available now and production will begin in 2026.

The HVC 5481G SoC is compatible with TDK’s existing HVC 5x family software, integrating an ARM Cortex-M3 central processing unit (CPU) with 64 kb flash memory and 8 kb SRAM. It operates directly from the 12 V automotive supply rail and integrates a LIN transceiver for communication.

The IC supports various motor control algorithms from sensor-less 6-step commutation using BEMF detection to single shunt Field Oriented Control (FOC) algorithms for low noise and high efficiency. The device includes seven general-purpose IO pins, internal timers, and capture compare registers, allowing seamless interfacing with the Micronas Hall-effect or TDK TMR sensors.

The HVC 5481G is available in a compact 5 x 5 mm PQFN32 package and certified according to AEC-Q100 Grade 1 standards for automotive for medium-power BLDC applications.

Source: TDK

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