Nexperia is offering its automotive power MOSFETs in a new thermally-enhanced, loss-free package with a footprint that it says is 80% smaller than industry-standard devices.
LFPAK33 MOSFETs enable the infrastructure that powers contemporary automotive subsystems such as radar and ADAS technology. In the industry, pressure is growing to reduce the size of modules in the car while continuing to improve energy efficiency and reliability.
The Nexperia LFPAK33 package uses a copper clip design to reduce resistance and inductance, which in turn reduces the RDS(on) and losses of the MOSFET. The package has a footprint of only 10.9 sq mm, and because no glue or wires are used internally, operating temperatures of up to 175˚ C are possible. Devices can handle up to 70 A, and the product portfolio includes devices that range between 30 V and 100 V, with an RDS(on) as low as 6.3 mΩ.
“As more subsystems are crammed into cars the need for rugged, compact power systems is becoming ever greater,” said Richard Ogden, International Product Marketing Engineer at Nexperia. “This extension of our LFPAK portfolio provides designers with more product choices than anywhere else on the market today.”