Cell-to-Pack is the direct bonding of individual battery cells to the battery pack’s cooling plate, and it’s a new trend in the EV market. It improves performance by providing higher pack energy density, improved part complexity, lower thermal loads on the battery pack, and simpler, lower-cost manufacturing of packs. To support Cell-to-Pack (CTP), new thermally conductive adhesive technology is necessary. These adhesives should have high thermal conductivity with low viscosity, like the new urethane adhesive we have developed. Those experts working on the design and manufacturing of battery systems, especially automotive OEMs, would find these new developments important.

This session at our Fall Virtual Conference on EV Engineering, presented by Parker Lord, will highlight the key factors motivating EV manufacturers to move away from traditional modular designs to new CTP designs.

Reserve your spot—it’s free!

Other sessions at our Spring Virtual Conference include:

Interconnect Solutions For The Production Of State-Of-The-Art Battery Modules

State-of-the-art joining technologies for batteries overview including pot/resistance welding, US-Bonding, Laser, and Laserbonding. For any kind of battery pack, it is crucial to reliably interconnect the individual cells to the power train and the BMS. F&K DELVOTEC offers a wide range of solutions for the and production the Battery cell interconnections.

In this session, we will present detail on the laser process, the advantages of laserbonder concept, and show application examples like:

• BMS contacting with nickel ribbon
• MERSEN Infinity cell assembly with Delvotec Laserbonders

Register here to learn more—it’s free!

See the full session list for the Fall Virtual Conference on EV Engineering here.

Broadcast live October 17 – 20, 2022, the conference content will span the EV engineering supply chain and ecosystem, including motor and power electronics design and manufacturing, cell development, battery systems, testing, powertrains, thermal management, circuit protection, wire and cable, EMI/EMC and more.