Infineon’s new silicon carbide power module for EVs

At its virtual PCIM booth (July 1-3), Infineon Technologies will present the EasyPACK module with CoolSiC automotive MOSFET technology, a 1,200 V half-bridge module with an 8 mΩ/150 A current rating.

With the introduction of the CoolSiC automotive MOSFET technology into the EasyPACK, Infineon is expanding the range of uses for the module family to include high-voltage applications in EVs with high efficiency and switching frequency requirements. These include HV/HV-DC-DC step-up converters, multi-phase inverters and fast-switching auxiliary drives such as compressors for fuel cells.

CoolSiC automotive MOSFET technology is designed for traction inverters, with a focus on low conduction losses, especially under partial load conditions. Infineon says the module, combined with the low switching losses of silicon carbide MOSFETs, reduces inverter losses by around 60 percent compared to silicon IGBTs.

The CoolSiC automotive MOSFET power module meets the AQG 324 Automotive Power Module Qualification Guideline.

Mass production of the EasyPACK CoolSiC Automotive MOSFET module FF08MR12W1MA1_B11A is underway. It will be available through distributors starting in September 2020. 

Source: Infineon