Infineon Technologies has introduced a new automotive power module with CoolSiC MOSFET technology. At this year’s virtual PCIM trade show, Infineon will present the new HybridPACK Drive CoolSiC, a full-bridge module with a 1,200-volt blocking voltage optimized for EV traction inverters. The power module is based on the automotive CoolSiC trench MOSFET technology for high-power and high-performance applications.
“The 800 V system of the Electric Global Modular Platform (E-GMP) represents the technological basis for the next generation of electric vehicles with reduced charging time,” said Dr. Jin-Hwan Jung, Head of Hyundai’s Electrification Development Team. “By using traction inverters based on Infineon’s CoolSiC power module, we were able to increase vehicle range by more than five percent because of efficiency gains resulting from the lower losses of this SiC solution.”
“The e-mobility market has become highly dynamic, paving the ground for ideas and innovation,” said Mark Münzer, Infineon’s Head of Innovation and Emerging Technology. “As the price of SiC devices decreases, the commercialization of SiC solutions will accelerate, resulting in more cost-efficient platforms adopting SiC technology to improve EV range.”
The HybridPACK Drive was introduced in 2017, using Infineon’s silicon EDT2 technology, specifically designed to improve efficiency on a real-world driving cycle. It offers a scalable power range of 100 kW to 180 kW within the 750 V and 1,200 V class.
The power module offers an upscale path from silicon to silicon carbide with the same footprint, allowing power up to 250 kW, greater range, smaller battery size and optimized system size and cost. The product is available in two versions with different chip counts, resulting in either a 400 A or 200 A DC rating version in the 1,200 V class.