Infineon has released the EasyPACK 2B EDT2, a flexible and scalable half-bridge power module. The 750 V device can reach a maximum power of up to 50 kW and current of 230 A rms. The module is optimized for inverter applications in hybrid and electric vehicles.

The main feature of the EDT2 technology is higher efficiency at low-load conditions. An EDT2 chip ensures lower losses than current products, and outperforms Infineon’s previous chip generation by 20 percent.

EasyPACK uses a plug-and-play approach to simplify module integration, and its PressFIT contact technology eliminates soldering of the pins required by through-hole discrete packages and Infineon’s HybridPACK 1.  A reduction in package size allows three EasyPACK 2Bs to take up 30 percent less surface area than a HybridPACK 1. EasyPACK 2B EDT2 is also qualified to the AQG324 standard.

 Source: Infineon