IoT technology can be a two-edged sword. On the one hand as connectivity is integrated into all forms of smart devices, increased performance is a significant benefit, bringing cloud capabilities directly to the users and devices that need them. On the other, this increased performance together with an ever-shrinking PCB footprint results in the need to dissipate greater amounts of excess heat. This buildup of excess heat causes 55% of electronic systems to fail.
How can one avoid this trade-off? Enter Thermal Interface Materials (TIMs), a category of products used to aid thermal conduction between mated surfaces such as a semiconductor device and a heat sink. TIMs can increase a component’s life span, reducing the temperature by 10ºC or more.