Dutch semiconductor company Nexperia is now offering a portfolio of 16 new low VF optimized planar Schottky diodes in CFP2-HP packaging.

The portfolio includes eight industrial (e.g. PMEG6010EXD), as well as eight automotive AEC-Q101 qualified (e.g. PMEG4010EXD-Q) products. The release supports the growing trend for manufacturers to replace devices in SMA/B/C type packaging with smaller footprint CFP-packaged devices, especially in automotive applications, according to the company. The diodes are suitable for use in DC-DC conversion, freewheeling, reverse polarity protection and other applications.

For maximum design flexibility, the portfolio extension offers reverse voltages VR(max) ranging from 20 V to 60 V and forward currents IF(average) of 1 A and 2 A. The exposed heatsink of the CFP2-HP enables the highest level of heat dissipation (Ptot) at a small package footprint. The CFP2-HP package dimensions are 2.65 mm x 1.3 mm x 0.68 mm, including leads.

Using a copper clip design, the packages aim to meet the challenging demands of efficient and space-saving designs. Nexperia’s Schottky and Recovery Rectifier Diodes use CFP packaging and it will soon extend them to bipolar transistors. Nexperia is also releasing a low IR optimized portfolio of planar Schottky diodes for automotive and industrial applications.

“As the industry transitions to multi-layer PCBs, a trend driven by the increasing popularity of high-performance microcontrollers, packaging becomes a crucial part of the thermal system,” said Frank Matschullat, Product Group Manager Power Bipolar Discretes at Nexperia. “Modern CFP packaging technology, designed for multilayer PCBs, offers equal electrical performance on a smaller footprint, reducing part and system costs.”

Source: Nexperia