New Jersey-based Magna-Power Electronics has developed a thermal paste for power electronics applications including vehicles.
Pitel Paste AZ-01 has a thermal resistance of 6.5 x 10-6 K·m2/W and comes in seven 1-19,000 ml containers. It comes in syringe, container and tube packaging.
A thermal interface material between metal surfaces can reduce thermal resistance by two orders of magnitude. As new gallium-nitride (GaN) and silicon-carbide (SiC) wide-bandgap semiconductors enable higher power densities, thermal transfer considerations in power electronics are becoming more important, the company said.
Magna-Power will publish a series of white papers on its thermal paste use and technical expertise. The first of these, Thermal Paste Surface Application in Power Electronics Manufacturing, examines dispensing methods, automation, volume precision, placement precision and setup costs.
“Pitel Paste has been formulated to achieve the ideal balance between thermal, electrical and rheological properties,” said Stan Jaracz, a Senior Chemical Engineer at Magna-Power Electronics. “It is the thermal interface material for all application methods from spatula to stencil, providing excellent thermal transfer properties, with a packaging portfolio that tailors Pitel Paste for many electronics manufacturing processes.”
Source: Magna Power