Many power electronics today are being designed for use in high-temperature, high-voltage environments, such as inside electric vehicles. However, size, weight, and power (SWaP) are also key factors driving electronic product development. These conflicting design criteria are an issue for many electrical engineers because space is not available to simply add a cooling system, as this will add weight and increase the product’s overall footprint. Therefore, many of these electronic components are susceptible to “running hot” at the high temperatures and high voltages used in these tiny spaces.