Adopting digital prototyping techniques to explore the full design space and reduce the typical trial-and-error approach of physical prototyping, has been stifled by the limited computational resources available to engineers. Local computing power does not scale up on-demand, nor offers continuously evolving full-spectrum simulation and analysis capabilities. In this whitepaper, we discuss how the availability of cloud-native engineering simulation software mitigates these longstanding bottlenecks for engineers who design and test thermal management solutions for electronics.
The whitepaper discusses how cloud-native CAE equips teams of designers and engineers with a simulation platform to investigate heat and fluid flow in order to develop the best thermal management strategies and predict design performance in the early stages of product development when. By accessing the practically unlimited power of the cloud, engineers can simulate and analyze high-fidelity models with complex physics with unprecedented accuracy in results, efficiency in design collaboration, and versatility in the vast range of electronics cooling applications that can be solved.