Semiconductor provider STMicroelectronics is supplying SiC semiconductors for SEMIKRON’s eMPack EV power modules. “In addition to its transformative effect in e-mobility, our SiC technology, now in its third generation, is driving increased efficiency, performance and reliability in sustainable energy and industrial power-control applications,” said STMicroelectronics Executive VP Edoardo Merli.
As part of a four-year technical collaboration, SEMIKRON and STMicroelectronics engineers integrated STPOWER SiC MOSFETS with SEMIKRON’s fully sintered Direct Pressed Die (DPD) assembly process. According to STMicroelectronics, DPD “enhances module performance and reliability, and enables cost-effective power and voltage scaling.”
The eMPack is available with 750 V and 1,200 V platforms, and covers applications from 100 kW to 750 kW and battery systems ranging from 400 V to 800 V.
Semikron says it has a billion-euro contract to supply a German carmaker with eMPacks, and production is slated to begin in 2025.
“As we now move towards volume production, our collaboration with ST brings the assurance of a robust supply chain that gives control over quality and delivery performance,” said CEO and CTO of SEMIKRON Karl-Heinz Gaubatz.