Infineon has released the EasyPACK 2B EDT2, a flexible and scalable half-bridge power module. The 750 V device can reach a maximum power of up to 50 kW and current of 230 A rms. The module is optimized for inverter applications in hybrid and electric vehicles. The main feature of the EDT2 technology is higher… Read more »
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Infineon introduces SiC six-pack power module for EV traction inverters
Infineon Technologies has introduced a new automotive power module with CoolSiC MOSFET technology. At this year’s virtual PCIM trade show, Infineon will present the new HybridPACK Drive CoolSiC, a full-bridge module with a 1,200-volt blocking voltage optimized for EV traction inverters. The power module is based on the automotive CoolSiC trench MOSFET technology for high-power… Read more »
Infineon’s 650 V CoolSiC Hybrid Discrete supports bidirectional charging
Infineon‘s new 650 V CoolSiC Hybrid Discrete for Automotive contains a 50 A TRENCHSTOP 5 fast-switching IGBT and a CoolSiC Schottky diode. The combination supports bidirectional charging, making it suitable for fast-switching automotive applications such as onboard chargers, power factor correction, and DC-DC or DC-AC converters. Infineon says the integrated fast-switching 50 A IGBT enables… Read more »
Infineon’s new power module for mid-power EV traction inverters
Infineon Technologies has introduced the HybridPACK DC6i, a new IGBT power module tailored to the needs of EV traction inverters in the 80 kW to 100 kW power class. It combines Infineon’s EDT2 IGBTs with package technologies for compactness, thermal management at reduced material cost and easy installation. Within Infineon’s portfolio, the HybridPACK DC6i is… Read more »
Infineon to supply Danfoss with power semiconductors for EVs
Danfoss and Infineon Technologies have signed a multi-year volume supply agreement. Infineon will supply chipsets of IGBTs and diodes to Danfoss Silicon Power, to be used in power modules for inverters that control EV motors. “The market for electromobility is picking up noticeably, and the supply industry is getting ready for this,” said Claus Petersen,… Read more »
Infineon’s new silicon carbide power module for EVs
At its virtual PCIM booth (July 1-3), Infineon Technologies will present the EasyPACK module with CoolSiC automotive MOSFET technology, a 1,200 V half-bridge module with an 8 mΩ/150 A current rating. With the introduction of the CoolSiC automotive MOSFET technology into the EasyPACK, Infineon is expanding the range of uses for the module family to… Read more »
Infineon’s new 900 A IGBT chip offers 30% less static loss
German semiconductor manufacturer Infineon has introduced a new version of its IGBT7 chip in its TRENCHSTOP line that boasts 30% less static loss than previous models. The 1,200 V module provides a leading nominal current of 900 A. Infineon says this enables a 30% higher inverter output current from the same frame size compared with… Read more »
Infineon’s new EasyPACK modules with CoolSiC MOSFETs designed for charging stations
Semiconductor manufacturer Infineon Technologies has launched two new 1,200 V EasyPACK modules with SiC MOSFETs as part of its 1,200 V series. Infineon says the new product is designed to meet the growing demand for silicon carbide (SiC) solutions. Both the Easy 1B and Easy 2B integrate Infineon’s CoolSiC MOSFETs and are aimed at both… Read more »
Infineon to acquire Cypress Semiconductor for $10 billion
Semiconductor manufacturer Infineon Technologies has acquired Cypress Semiconductor Corporation for $23.85 per share, or about $10.1 billion. The acquisition will add Cypress’s microcontrollers and software and connectivity components, such as NOR flash memories, to Infineon’s portfolio. If approved by Cypress’s shareholders and regulatory agencies, the acquisition is expected to close by early 2020. Reinhard Ploss,… Read more »
DENSO invests in Infineon, citing increased importance of semiconductors
Global automotive supplier DENSO has taken a stake In Infineon Technologies, a company that makes in-vehicle semiconductor products, including microcomputers for control applications, semiconductor sensors and other components for electrified vehicles. The Triple Trend of vehicle electrification, autonomy and connectivity is driving increased demand for semiconductor products, so DENSO aims to increase its expertise in… Read more »