A technical look at NanoPlex™ LDF and the Power Ring Platform 800V+ SiC inverters place demands on DC-link capacitors that conventional dielectric films cannot meet. Advanced Conversion has addressed this for years through its patented Power Ring platform, paired with high-temperature PEN HV polymer dielectric film. However, with the high-temperature film supplier exiting the market,… Read more »
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TDK launches new DC-link film capacitors for high-frequency SiC power converters
TDK has introduced the B25696H series, a family of MKP DC-link film capacitors engineered for the higher switching frequencies and faster voltage transitions of SiC-based power converters. The series covers capacitance values from 47 µF to 1280 µF across rated DC voltages from 900 V to 2,000 V, designed for energy storage systems, traction drives,… Read more »
Infineon’s new H-DPAK puts a 750 V CoolSiC half-bridge in a top-side-cooled package for EV OBCs and DC-DC converters
Infineon has introduced the H-DPAK, a new package housing an integrated half-bridge built on its 750 V CoolSiC G2 SiC MOSFET technology. The device is designed for power conversion applications in automotive and industrial systems, including single-stage and two-stage on-board chargers, DC-DC converters and EV auxiliaries, as well as HVDC AI server power supplies and… Read more »
Toshiba’s new SiC MOSFET cuts on-resistance area by 58% for 1,200 V power stages in EV chargers
Toshiba has started shipping test samples of the TW007D120E, a 1,200 V trench-gate SiC MOSFET designed for power supply systems in high-power applications, including EV charging stations, energy storage, AI data centers and photovoltaic inverters. The device is built around Toshiba’s proprietary trench-gate structure, which embeds gate electrodes directly in etched trenches in the semiconductor… Read more »
Fraunhofer IZM’s novel SiC inverter hits 99% efficiency in a 1-liter package for 800 V EV drives
Fraunhofer IZM has developed a 500-kW inverter that fits in a volume of 1 liter—500 kVA per liter—with peak efficiency exceeding 99%. The unit was built for Mitsubishi Heavy Industries and is designed for 800 V DC drives, delivering 500 A RMS per phase with an effective inductance of approximately 1 nanohenry and switching speeds… Read more »
ROHM’s new 5th-gen EcoSiC devices cuts SiC MOSFET on-resistance 30%
ROHM has developed its 5th Generation SiC MOSFETs under the EcoSiC brand, delivering approximately 30% lower ON resistance during high-temperature operation compared to its 4th Generation devices. The comparison is at Tj=175°C with equivalent breakdown voltage and chip size—meaning the reduction comes from structural enhancements and manufacturing process optimization, not geometry scaling. Lower on-resistance at… Read more »
Peak Nano and Advanced Conversion partner on DC-link capacitors for 800 V+ SiC EV inverters
Peak Nano and Advanced Conversion have announced a partnership to co-develop DC-link capacitor solutions engineered specifically for 800 V+ SiC inverter systems in electric vehicles and e-mobility platforms. Advanced Conversion is a wholly owned subsidiary of ETI, based in Clearwater, Florida. The collaboration pairs Peak Nano’s NanoPlex LDF (Low Dissipation Factor) capacitor film with Advanced… Read more »
SemiQ’s 1200 V QSiC Dual3 half-bridge modules reach 240 W/in³ for ESS converters, AI cooling
SemiQ has introduced its QSiC Dual3 family of 1200 V half-bridge SiC MOSFET modules for applications including motor drives in data center cooling systems, grid converters in energy storage systems and industrial drives. The new lineup includes six modules in a 62 mm x 152 mm S4B1 half-bridge package, with on-resistance options of 1 mΩ,… Read more »
Microchip’s BZPACK mSiC power modules target harsh environments with >1,000-hour HV-H3TRB performance
Microchip Technology has introduced its BZPACK mSiC power modules, a new silicon carbide module family aimed at industrial and renewable-energy systems that have to survive heat, humidity, and high voltage over long operating lives. The key selling point is environmental robustness. Microchip says the modules are tested to meet High Humidity High Voltage High Temperature… Battery Technology, Circuit Protection, Contactors & Fuses, Electric Motor Design & Manufacturing, Manufacturing, OEM News, Semiconductor & Chips, Thermal Management
Unlocking Next-Gen xEV Power Conversion: New CoolSiC™ Devices
Join this webinar to gain valuable insights on the latest power conversion trend, topologies evolution, application requirements and the latest CoolSiC™ AEC-Q qualified products from Infineon. Additionally, you will understand how new innovative CoolSiC™ power devices will revolutionize the automotive industry by enabling cost-effective single-stage Onboard Chargers (OBCs). Presented by: Torsten Klemmer, Application Director xEV… Read more »