Sponsored by Hesse Mechatronics All electronic devices need to be connected electrically (and mechanically) and there are numerous ways of completing this task. Wire bonding is one type of interconnection. There are three types of wire bonding: thermocompression, thermosonic and ultrasonic. We will focus on ultrasonic wedge bonding with aluminium wire and discuss the wire bonding process… Read more »
Sponsored Content
Fuji increases power density with SiC and new packaging technologies
Sponsored by Fuji Electric By: Y. Iwasaki, M. Chounabayashi, M. Nakazawa, S. Iwamoto, Y. Oonishi, M. Hori, H. Kakiki and O. Ikawa, Fuji Electric Co., Ltd. Current market requirements are trending towards further downsizing and increased efficiency of power conversion systems. For this reason, enhanced power density of the power modules will be critical in order… Read more »