Sponsored by Dana. Today, original equipment manufacturers (OEMs) are looking for cooling solutions that reduce costs and enhance efficiency. Long® double-sided insulated gate bipolar transistor (IGBT) cooling systems produced by Dana enable electrified vehicles to achieve consistent operation and long-lasting performance. As OEMs design electrified vehicles that compete with traditional combustion engines, the need for… Read more »
Sponsored by EPCOS, a TDK Group Company By Joseph Pulomena, EPCOS Inc., A TDK Group Company Automobiles have changed significantly over the past 40 years from mechanical systems to computerized systems. As a result there is an increased need for electromagnetic compatibility (EMC) filters in today’s electric and hybrid vehicles. The history 40 years ago… Read more »
Sponsored by OCSiAl Group Li-ion batteries represent the most dynamic and fastest growing battery market, with total sales of $10 billion in 2015 [i]. Historically, the primary challenge for battery manufacturers has been the constant demand for greater energy density, both volumetric and gravimetric. Li-ion’s dramatic rise is in large part due to solving this challenge more… Read more »
Sponsored by AVL Because integrated validation is only carried out during vehicle tests, development and validation of individual electrical components and the interaction of the overall system is often time-consuming. Using integration test stands, AVL is changing this process for electric drives. The majority of OEMs examine electrical and electronic drive components individually during the… Read more »
Sponsored by Hesse Mechatronics All electronic devices need to be connected electrically (and mechanically) and there are numerous ways of completing this task. Wire bonding is one type of interconnection. There are three types of wire bonding: thermocompression, thermosonic and ultrasonic. We will focus on ultrasonic wedge bonding with aluminium wire and discuss the wire bonding process… Read more »
Sponsored by Fuji Electric By: Y. Iwasaki, M. Chounabayashi, M. Nakazawa, S. Iwamoto, Y. Oonishi, M. Hori, H. Kakiki and O. Ikawa, Fuji Electric Co., Ltd. Current market requirements are trending towards further downsizing and increased efficiency of power conversion systems. For this reason, enhanced power density of the power modules will be critical in order… Read more »