Ag Free AMB Silicon Nitride Substrate for Automotive Applications
Habib Mustain, Power Electronics Segment Manager Americas, Heraeus Electronics
Traditionally silicon nitride (Si3N4) Active Metal Brazed (AMB) substrates are considered as the best substrate solution to fulfill the high requirements on heat dissipation and high-power density for automotive power modules. The drawback of Si3N4 based AMBs are the high costs. Heraeus Electronics has developed an alternative unique cost-effective condura®.ultra Si3N4 Ag free AMB substrate to meet the hybrid/electric vehicles drive train power module requirement.
In this presentation, the performance of condura®.ultra Si3N4 Ag free AMB technology in comparison with the standard AMB substrate which is a well-known benchmark in the industry will be demonstrated. Several industry standard tests have been performed to check the reliability, mechanical integrity and processability of the substrate. Tests such as thermal shock tests (-65 0 C/ + 150 0C, liquid to liquid), peel strength test, high temperature storage, thermal resistance, and partial discharge tests were conducted.
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