The Challenges Of High-Reliability Power Electronics Assembly And The Emerging Materials Solutions

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Recorded Sep 3, 2020 9:30 am EDT

As power devices evolve to handle increased power density, higher junction temperatures, and incorporate smaller packaging, the increased requirements for high-reliability power electronics have posed many challenges to the packing and assembly processes. In this session, we will analyze the major challenges within high-reliability power electronics substrate- and die-attach applications, as well as provide an overview of the innovative materials solutions for these applications that can help achieve high power density and promote better heat dissipation, resulting in highly-reliable power devices.

Presented by Joseph Hertline, the Product Manager for Engineered Solder Materials focusing on Power Electronics applications. Joseph is responsible for driving the growth of the power electronics product line through development and implementation of marketing strategies supported by customer experience, emerging technologies, and industry feedback. Joe also collaborates with Indium Corporation's sales, technical support, R&D, production, and quality teams to serve existing customers and grow new business in his designated market.

Presented by:

  • Joseph Hertline , Product Manager – ESM/Power Electronics, INDIUM








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