Innovative Cooling Concepts For Enhanced Power Density In Electrified Vehicles

Presented by:

  • Rafael Garcia, System Architect for OBC and DCDC applications, Infineon

  • Ismail Recepi, Senior Research Engineer, Research Unit Packaging & Multiphysics (PM), Division Power Electronics, Silicon Austria Labs (SAL)

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Sep 19, 2024, 8:00 am EDT

Maximizing power density is what designers of power conversion systems in EVs strive for. Component packaging and cooling mechanisms become increasingly important in achieving this goal.

Infineon and Silicon Austria Labs (SAL) collaborate to push the boundaries by going beyond current design requirements. Together we work on developing new cooling concepts that can improve power density, simplify manufacturing, and reduce system costs.

In this webinar, we will explore the innovative concept of top-side cooling packages and how to use them in your designs. On top, we will provide an exclusive overview of future-forward concepts that are on the horizon.

Join us and benefit from your competitive advantage.







All Sessions: September 2024 Conference


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