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Challenges And Solution For Pick And Place Automation Of Thermal Gap Filler Pads

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Automation in electronics manufacturing is nothing new, but today many thermal gap filler pads are still placed by hand. With an increasing demand for automation the need to incorporate gap filler pad installation into automated processes is growing.

In this webinar we will discuss what makes gap filler pads a challenge for pick and place manufacturing processes and how to address the specific handling challenges of gap filler pads.



Now available to watch on-demand: Register for this webinar to watch a recording of the presentation and audience Q&A, and download the presentation slides.

Presented by:

  • Christian Miraglia, Applications Engineering Manager Fujipoly America-Customer Engineering Resource Center (CERC), Fujipoly America

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