Automotive Power Electronics Engineering

Your source for power electronics engineering know-how.

Mitigating Stress In PCB Assemblies: Understanding Thermal Gap Filler Compression And PCB Deflection

Session Banner

Webinar

Register

Live webinar starts in:

  • 0 Days
  • 0 Hours
  • 0 Minutes
  • 0 Seconds
Thermal gap fillers are essential for managing heat in today's compact electronics, but they can also introduce unwanted stress and deflection in your PCB assemblies.

Join us for this insightful webinar, where we'll unravel the complexities of thermal gap filler implementation and PCB mechanics. We'll explore:

• Types of Gap Fillers - Discover the differences of dispensable, putty, and viscoelastic gap fillers, and learn which is best suited for your application.

• Compression Characteristics - Understand how factors like gap filler type, thickness, and compression rate impact the stress exerted on your PCB

• PCB Deflection - Learn how a PCB reacts under load and how the addition of a gap filler and support structure location influences deflection

• Stress Management Techniques - Gain practical strategies for minimizing stress, including gap filler selection, optimized PCB layout, and support implementation

You will leave this webinar empowered to make informed decisions about thermal gap filler selection and application, ensuring your PCB designs remain stress-free and reliable.

Now available to watch on-demand: Register for this webinar to watch a recording of the presentation and audience Q&A, and download the presentation slides.

Presented by:

  • Daniel Rosero, Applications Engineer, Fujipoly

More Power Electronics Engineering Knowledge:

View More
Privacy Policy, Terms of Use
CHARGED is a registered Trademark of Electric Vehicles Magazine, LLC