Posts Tagged: Power Electronics

Nexperia’s next-gen 650 V gallium nitride (GaN) technology

Nexperia has announced a new range of GaN FETs featuring next-generation high-voltage GaN HEMT H2 technology. The devices will be available in both TO-247 and the company’s proprietary CCPAK surface-mount packaging. Nexperia says its devices achieve superior switching FOMs and on-state performance with improved stability, and simplify application designs. Because the parts are configured as… Read more »

Vitesco and ROHM cooperate on silicon carbide power solutions

EV powertrain supplier Vitesco Technologies and silicon carbide specialist ROHM Semiconductor have signed a development partnership under which Vitesco will use ROHM’s SiC components to increase the efficiency of its EV power electronics.  “Energy efficiency is of paramount importance in an EV. As the traction battery is the only source of energy in the vehicle,… Read more »

VisIC partners with ZF to develop next-gen EV inverters

ZF Friedrichshafen and VisIC Technologies have announced a partnership to create a new generation of EV drivelines. The focus of the joint effort will be on 400-volt driveline applications, covering the largest segment of the EV market. ZF specializes in wide-band-gap semiconductor technology, such as silicon carbide and gallium nitride. Gallium nitride semiconductors are thought… Read more »

Webinar: Thermal and EMI shielding materials for automotive electronics

Protecting automotive electronics from high temperatures and electromagnetic interference to improve the performance of xEVs and Advanced Driver-Assistance Systems (ADAS) Powered by advancements in technology, the implementation of ADAS and electrified vehicles is rapidly accelerating. The complex systems that power these new vehicles rely on electronics—making reliable operation of these systems critical for safe vehicle… Read more »

Cree’s 650 V SiC MOSFETs designed for onboard EV charging

Cree recently released the Wolfspeed 650 V silicon carbide MOSFET series, designed for the next generation of onboard EV chargers, data centers and renewable energy systems. “Cree is leading the global transition from silicon to silicon carbide, and our new 650 V MOSFET family is the next step in delivering a high-powered solution to a… Read more »

Microchip expands SiC family of power electronics

Microchip Technology has expanded its portfolio of silicon carbide (SiC) power modules for high-power system control, gate drive and power stages. Microchip’s SiC family includes Schottky Barrier Diode (SBD)-based power modules in 700, 1,200 and 1,700 volt versions. The new power module family includes various topologies, including dual diode, full-bridge, phase leg, dual common cathode,… Read more »

Power Integrations’ SCALE-iDriver for SiC MOSFETs achieves AEC-Q100 automotive qualification

Power Integrations has announced that its SIC118xKQ SCALE-iDriver, a single-channel gate driver for silicon carbide (SiC) MOSFETs, is now certified to AEC-Q100 for automotive use. The drivers, which include safety and protection features, can be configured to support gate-drive voltage requirements of commonly used SiC MOSFETs. The SIC1182KQ (1,200 V) and SIC1181KQ (750 V) SCALE-iDriver… Read more »

Vishay releases AEC-Q200 thick film high power resistors for auto applications

Vishay Intertechnology recently introduced a line of high power resistors that meet the AEC-Q200 automotive qualification. Designed for direct mounting on a heatsink, the Vishay Sfernice LPSA 300, LPSA 600, and LPSA 800 deliver high power dissipation and pulse handling capabilities intended to reduce component counts and lower costs in automotive applications. With power ratings… Read more »

Here’s why Tesla transitioned to a semi-custom power module design in Model 3 inverter

A closer look at semiconductor packaging considerations in EVs One of the most critical decisions to be made at the earliest stage of designing a new power converter concerns the packages used for the semiconductors, as pretty much every other aspect of the design hinges on their physical form. This is especially true for the main… Read more »