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Free EV Engineering Webinar:

Use Of Residue Free Pastes In Vacuum Soldering Equipment

Presented by:

  • Thomas Krebs, Technology Consultant, PINK GmbH Thermosysteme

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Sep 16, 2025, 9:30 am EDT

Residue-free pastes provide tackiness and printability, and do not leave residues behind after reflow. The advantage is a noticeable cost saving, as there is no need to clean the substrates after soldering.

Residue-free pastes do not contain any activators. Therefore, formic acid must be used to deoxidize the solder powder and the interconnect surfaces for successful soldering. Residue-free pastes also release significantly more volatiles than resin-based solder pastes, which require special handling of the volatiles in the oven, e.g., to avoid frequent maintenance.

Join this presentation where we will discuss the properties of residue-free pastes and technical solutions for vacuum reflow equipment.


Now available to watch on-demand: Register for this webinar to watch a recording of the presentation and audience Q&A, and download the presentation slides.


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All Sessions: September 2025 Conference


Free EV Engineering Webinars
The sessions from our September 2025 EV Engineering Conference are now available to view on-demand. Register for a session below to watch the recording and download the presentation.

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