Charged EVs logo

Free EV Engineering Webinar:

A Comparison Of Module Sintering Vs Soldering: Best Performance Vs Best Cost

Presented by:

  • Thorsten Vehoff, Head of Technical Solution Management, Heraeus

Session Banner

Sep 18, 2025, 10:15 am EDT

SiC chips have revolutionized not only the performance of power modules but also the surrounding packaging technologies. Chips are no longer soldered but sintered, die top connections are no longer Aluminum wires but Cu wires on die top systems or Cu clips. So, what is the next level module connection? Sintering with large area silver sinter paste for best performance or soldering with high reliability solder preforms for best cost?

In this webinar, we compare soldering with Innolot preforms to sintering with PE360P, our silver sinter paste designed for printing, and highlight the benefits and drawbacks of each approach.

Clearly, the preforms win on the price, application is simple via pick and place process from a waffle pack and are pre-cut to match the substrate design. The solder melts at 218°C and requires flux or formic acid for the soldering to work properly. No pressure is required. It shows excellent reliability for thermal cycling from -40°C to +125°C, i.e. less than 3% after 2000 cycles compared to over 15% for SAC. However, for thermal shock testing from -50°C to +150°C it shows substantial (> 40%) delamination after 500 cycles.

This is where large-area sintering comes in. It shows only slight (< 3%) delamination after 500 cycles of temperature shock and only in the very corners of the substrate. It is applied by stencil printing but requires 5 minutes of 12 MPa pressure at 230°C for sintering. It is also significantly more expensive due to its 87% silver content, compared to only 3.8% for the IL preforms. However, the higher reliability and higher thermal conductivity (sintered silver is at > 200 W/mK while solder materials are < 65 W/mK), the resulting improved thermal resistance may well make it worth it for high power modules.

Join this webinar to learn more about a comparison of module sintering versus soldering.



Register





All Sessions: September 2025 Conference


A Virtual Conference on EV Engineering: September 15-18, 2025.
All live webcast sessions are free to attend and will be recorded for future viewing. Register for a session below to reserve your spot to watch it live or on demand.


First topics out now. Many more are coming soon. 

Privacy Policy, Terms of Use
CHARGED is a registered Trademark of Electric Vehicles Magazine, LLC

If you like our Virtual Conferences,
you’ll love our Magazine and Newsletters!

Sign up now, you can unsubscribe at any time: