Material Solutions for High Reliability and High Temperature Power Electronics

Presented by:

  • Aarief Syed-Khaja, Global Head of Engineering Services, HERAEUS ELECTRONICS

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Oct 21, 2021, 11:45 am EDT

Wide band gap semiconductors like silicon carbide (SiC) with superior performance have become the successors to traditional silicon devices for high performance power electronics. The state-of-the-art interconnection technologies are not anymore suitable to the demanding application requirements. The new generation power modules and systems require engineered matched materials as per the application. Heraeus provides innovative materials and matched material solutions that reduce complexity, improve reliability and address high temperature requirements. An overview of evolving trends in power electronics, challenges in new generation power electronics, application specific requirements and tailored solutions are highlighted in this talk.

All Sessions: October 2021 Conference

A Virtual Conference on EV Engineering: October 18-21, 2021.
All live webcast sessions are free to attend and will be recorded and available to watch on-demand after the event. Register for a session below and reserve your spot to watch it live or on-demand.

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