Starting in 2025, global technology company ZF will purchase silicon carbide devices from STMicroelectronics. The components are to be integrated into ZF’s new modular inverter architecture scheduled for series production in 2025.
To match customers’ performance requirements, ZF is able to connect a variable number of the devices together without altering the design of the inverter.
ZF says that double-digit millions of the devices are needed from ST to fulfill electromobility orders on its books through 2030 totaling more than €30 billion.
ST is to manufacture the chips at its production fabs in Italy and Singapore. The company will use its STPAK packaging system, and will perform testing at its facilities in Morocco and China.
“As a vertically integrated company, we are investing heavily to expand capacity and develop our silicon carbide supply chain to support our global and European customers,” said STMicroelectronics Automotive and Discrete Group President Marco Monti.