Heraeus Electronics can use Bosch’s patent portfolio to create its inorganic potting compound, CemPack, for power module encapsulation. The encapsulating material has a thermal conductivity of 5 W/m-K and temperature resistance of up to 300° C, increasing power densities and dependability. The licensing agreement also permits the encapsulation of passive components (magnetics, capacitors or resistors), electric motors (stators) and other devices that need a thermal bridge to a heat sink.
“The combination of expertise between Heraeus and Bosch enables a new type of encapsulants that will bring power electronic packages to the next level so that these packages can unfold the full potential of a new generation of semiconductors,” said Dr. Klemens Brunner, Head of Heraeus Electronics.
Source: Heraeus Electronics